The current status of developing single-ion implantation (SII) which e
nables us to implant dopant ions one by one into fine semiconductor re
gions is summarized. Single-ions extracted from a focused ion beam (FI
B) have been implanted into a nuclear track detector CR-39 and the ave
rage number of implanted ions by chopping the ion beam has been evalua
ted by counting the etch pits on the CR-39 formed by each single-ion i
ncidence. The detection efficiency of the single-ion incidence into a
target has also been evaluated by comparing the count of secondary ele
ctrons and the implanted ion number, and the controllability of implan
ted ion number by SII is discussed.