An evaluation of test methods for the detection and control of interconnect reliability

A number of fast, wafer-level test methods exist for interconnect reliabili ty evaluation. The relative abilities of four such methods to detect the qu ality and reliability of the interconnect over very short test times are ev aluated in this work. Four different test structure designs are also evalua ted, and the results are compared with package-level median time to failure (MTF) results. The Isothermal test method combined with Standard Wafer-Lev el Electromigration Accelerated Test (SWEAT)-type test structures is shown to be the most suitable combination for defect detection and interconnect r eliability control over short test times.