Kks. Lau et Kk. Gleason, Pulsed plasma enhanced and hot filament chemical vapor deposition of fluorocarbon films, J FLUORINE, 104(1), 2000, pp. 119-126
Fluorocarbon films from pulsed plasma enhanced chemical vapor deposition (P
PECVD) and hot filament chemical vapor deposition (HFCVD) show a greater ra
nge in composition and structure compared to films from conventional CVD pr
ocesses. Films were deposited using hexafluoropropylene oxide (HFPO), 1,1,2
,2-tetrafluoroethane (HFC-134) and difluoromethane (HFC-32) as the feed gas
es. Film characterization was performed through high resolution solid-state
F-19 and C-13 nuclear magnetic resonance (NMR) techniques. Increasing puls
e off-time during HFPO PPECVD resulted in films with more linear CF2 charac
ter and reduced the amount of cross-linking/branching, attributed to CF2 ch
ain propagation dominating during the off-time. HFC PPECVD films contained
significantly less fluorine and more of carbon unsaturation, attributed to
plasma hydrogen scavenging of fluorine to form hydrogen fluoride. Switching
from PPECVD to HFCVD with HFPO as the feed gas resulted in films resemblin
g bulk poly(tetrafluoroethylene) (PTFE), as a result of clean thermal break
down of HFPO to form polymerizing CF2 radicals. Isothermal annealing of PPE
CVD films revealed two different thermal decomposition pathways: one which
involved CF3 loss in more cross-linked films, and one which involved oligom
er desorption/chain unzipping in films with a substantial linear CF2 chain
component. (C) 2000 Elsevier Science S.A. All rights reserved.