The growth of copper sulfide thin films by the successive ionic layer adsor
ption and reaction (SILAR) method at room temperature and normal pressure w
as studied. The CuS films were characterized by chemical analysis, XRD, SEM
and UV spectroscopy, The growth rate of CuS was proportional to copper pre
cursor concentration. The films were polycrystalline and showed no preferre
d orientation. The surface of the CuS thin films was rough compared with Cd
S films, which were used as buffer layer on ITO and glass substrates to enh
ance the weak adhesion of CuS to oxide surfaces. (C) 2000 Elsevier Science
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