Pole-residue formulation for transient simulation of high-frequency interconnects using householder LS curve-fitting techniques

As digital circuits approach the GHz range, and as the need for high perfor mance wireless devices increases, new simulation tools which accurately cha racterize high frequency interconnects are needed, In this paper, a new mac romodeling algorithm for time domain simulation of interconnects is present ed. The algorithm incorporates Householder LS curve-fitting techniques. The approach generates a universal macromodeling tool that enables simulation of interconnects in a modified version of simulation program with integrate d circuit emphasis (SPICE). This results in a method that conveniently inco rporates accurate EM models of interconnects or experimental data into a ci rcuit simulator. The time domain simulation results using this new tool are compared with results from other simulators.