An efficient crosstalk parameter extraction method for high-speed interconnection lines

A proposal is presented for an effective extraction method for crosstalk mo del parameters of high-speed interconnection lines, In the extraction proce dure, mutual capacitance and mutual inductance of the coupled interconnecti on lines are extracted based on S-parameter measurement, time-domain-reflec tometry (TDR) measurement and subsequent microwave network analysis. The ex traction method is useful for characterizing homogeneous guiding structures , where the propagation of coupled transverse electromagnetic (TEM) modes i s supported. In contrast to previous extraction methods, the suggested proc edure requires fewer on-wafer probing steps and does not need matched termi nations in the test device for high-frequency probing. The extracted models can be readily used with simulation program with integrated circuit emphas is (SPICE) circuit simulation. The procedure can also be used for modeling the crosstalk in packaging structures and multichip module (MCM). The proposed procedure has been successfully applied to the crosstalk model extraction of on-chip interconnection lines. Crosstalk model parameters we re obtained for different line structures, spaces, and widths. Finally, the validity and reliability of the extracted models were examined by comparin g a SPICE circuit simulation using the extracted crosstalk model parameters with high-speed time-domain crosstalk measurement. A close agreement was o bserved in the amplitude and pulse shape between the simulation and the mea surement, showing the accuracy and usefulness of the proposed extraction me thod.