A fast simulator for electron beam lithography, called SELID, is presented
and applied in the case of homogeneous and multilayer substrates. For expos
ure simulation, an analytical solution based on the Boltzmann transport equ
ation is used instead of the Monte Carlo. All important phenomena (forward
scattering, backscattering, generation of secondary electrons) have been ta
ken into account for a wide range of e-beam energies. The case of substrate
s consisting of more than one layer (multilayer) is considered in depth as
it is of great importance in e-beam patterning. Results of simulation are c
ompared with experimental ones in the case of single pixel exposures. Addit
ionally, simulation results are compared with experimental ones for isolate
d and dense patterns in the sub-half-micron range, on conventional positive
resist on homogeneous and multilayer substrates. By using SELID, forecast
of resist profile with considerable accuracy for a wide range of resists, s
ubstrates and energies is possible. Additionally, proximity effect paramete
rs are extracted easily for use in any proximity correction package.