Large area submicrometer contact printing using a contact aligner

Submicrometer patterns were produced in a thin layer of gold over a 3 in. d iameter substrate with an accuracy of greater than or equal to 40 nm and a runout (feature to feature misalignment between the template and the stampe d pattern) of approximately 1 mu m, using microcontact printing (mu-CP). Su ccessful pattern reproduction required careful control of the forces exerte d on the substrate during the mu-CP process, as well as the encompassing pr essure, which was achieved using a custom-built stamp aligner. The use of a thin film stamp bonded to a rigid glass support in conjunction with the al igner significantly improved the runout and eliminated contact of recessed regions of the stamp with the substrate.