A velocity-field study of several Si0.8Ge0.2/Si p-channel MOSFETs with self
-aligned poly-Si gates, thick gate oxides and effective channel lengths ran
ging from 1.5 to 8.5 mu m, was carried out at room temperature. Comprehensi
ve two-dimensional simulations of devices using drift-diffusion (DD), and b
ulk Monte Carlo calibrated hydrodynamic (HD) and energy transport (ET) mode
ls have revealed enhanced high-field hole transport in strained-channel MOS
FETs. A close agreement is obtained between higher-level (HD/ET) models and
DD model with calibrated high-field mobility parameters. It is found that
the relatively low value of extracted saturation velocity in long-channel S
i0.8Ge0.2 p-MOSFETs increases considerably as the gate length is decreased.
The increase in short-channel samples is attributed to non-equilibrium tra
nsport effects in the region near the source, resulting from higher mobilit
y and longer relaxation times of holes in the strained SiGe layer. Our resu
lts not only confirm the expected advantage of strained SiGe p-MOSFETs in l
ow-field transport, but also indicate that this is accompanied by an early
onset of velocity overshoot, which may be beneficial in aggressively scaled
devices.