Passivation of compound-semiconductor surfaces for low-noise terahertz devices

Citation
Hl. Hartnagel et Ci. Lin, Passivation of compound-semiconductor surfaces for low-noise terahertz devices, VACUUM, 57(2), 2000, pp. 179-188
Citations number
13
Categorie Soggetti
Apllied Physucs/Condensed Matter/Materiales Science","Material Science & Engineering
Journal title
VACUUM
ISSN journal
0042207X → ACNP
Volume
57
Issue
2
Year of publication
2000
Pages
179 - 188
Database
ISI
SICI code
0042-207X(200005)57:2<179:POCSFL>2.0.ZU;2-M
Abstract
Pt/n-GaAs Schottky varactor diode is an important nonlinear element for fre quency multipliers in the submillimeter wavelengths. In the fabrication pro cess, SiO2-passivation is usually used to passivate the conductive active n -layer on the surface and reactive ion etching (RIE) technique is the stand ard technique to open Schottky contact area through the passivation. The ma in problem in the fabrication technique is to achieve the breakdown voltage as high as the avalanche breakdown theory predicts. Through optimization o f the passivation and the RIE technique, we have successfully increased the breakdown voltage near the theoretical value and suppressed the excess noi se resulted from the dry etching. Breakdown voltage of 18 and 9.5 V has bee n achieved with a doping level of 8 x 10(16) and 2.6 x 10(17) cm(-3), respe ctively. (C) 2000 Elsevier Science Ltd. All rights reserved.