Gallium alloy interconnects for flip-chip assembly applications

For miniature interconnection applications, innovative material systems bas ed on gallium alloys offer potentially attractive alternatives over commonl y used bonding materials, such as solders and conductive adhesives, without the reliability and environmental drawbacks. Gallium alloys are mechanical ly alloyed mixtures of a liquid metal and metallic powders, formed at room temperature. The alloys cure to form solid intermetallic compounds. In this work, gallium alloys have been investigated for flip-chip interconnect app lications. Specifically, this paper presents the results of a preliminary f easibility study demonstrating gallium alloys as advanced interconnect mate rials for flip-chip on laminate applications. The topics covered include th e test vehicle assembly process, reliability screening results, preliminary failure mode analysis, and interconnect microstructure analysis. To demonstrate preliminary feasibility and application, gallium alloyed wit h copper and nickel was used as micro-miniature interconnects between bare silicon chips and printed circuit boards. This study shows preliminary feas ibility of such interconnects and reliability tests demonstrate reasonable cyclic fatigue with the use of underfill. Moreover, through the course of t his work a new micro-deposition technology for gallium alloys was developed which leverages existing industry infrastructure. This initial study repre sents a significant advancement in microelectronic interconnect materials u nveiling the potential for an innovative lead-free, low-temperature interco nnect alternative.