Electroplating is an emerging technique for the production of microsystems.
This is due to advantages such as high rate of deposition, high resolution
, high shape fidelity, simple scalability, and good compatibility with exis
ting processes in microelectronics. Materials ranging from high-conductivit
y metals over soldering connections to ferromagnets can be deposited. In th
is paper the basics of electroplating are reviewed and examples of recent a
pplications of electroplating in the processing of microsystems are present
ed.