Electrodeposition for the synthesis of microsystems

Citation
W. Ruythooren et al., Electrodeposition for the synthesis of microsystems, J MICROM M, 10(2), 2000, pp. 101-107
Citations number
38
Categorie Soggetti
Mechanical Engineering
Journal title
JOURNAL OF MICROMECHANICS AND MICROENGINEERING
ISSN journal
09601317 → ACNP
Volume
10
Issue
2
Year of publication
2000
Pages
101 - 107
Database
ISI
SICI code
0960-1317(200006)10:2<101:EFTSOM>2.0.ZU;2-N
Abstract
Electroplating is an emerging technique for the production of microsystems. This is due to advantages such as high rate of deposition, high resolution , high shape fidelity, simple scalability, and good compatibility with exis ting processes in microelectronics. Materials ranging from high-conductivit y metals over soldering connections to ferromagnets can be deposited. In th is paper the basics of electroplating are reviewed and examples of recent a pplications of electroplating in the processing of microsystems are present ed.