Real-time observations of the film stress-thickness product are presented f
rom the growth of strained InGaAs/GaAs layers. Growth temperatures of 440 a
nd 520 degrees C were used with a nominal In composition of x=0.20. The dat
a are compared with a model of relaxation kinetics based on dislocation gli
de velocity. The residual strain is higher than predicted and the relaxatio
n is not markedly temperature dependent, in contrast to the model. These di
screpancies suggest that dislocation blocking causes incomplete relaxation
in this material system. (C) 2000 American Vacuum Society. [S0734-211X(00)0
1403-7].