Ws. Liao et Sc. Lee, INTERFACIAL INTERACTION BETWEEN AL-1-PERCENT-SI AND PHOSPHORUS-DOPED HYDROGENATED AMORPHOUS SI ALLOY AT LOW-TEMPERATURE, Journal of applied physics, 81(12), 1997, pp. 7793-7797
The interfacial interaction between phosphorus-doped amorphous silicon
hydrogen alloy ((n(+))a-Si:H) and thermal evaporated Al-1%Si layer af
ter furnace annealing in the temperature range from 150 to 250 degrees
C has been investigated in detail. The scanning electron microscope p
hotographs show that many dendrites were formed on the original(n(+))a
-Si:H surface at annealing temperature higher than 170 degrees C. Rama
n spectroscopy and transmission electron diffraction show that the ori
ginal (n(+))a-Si:H film has been converted to polycrystalline Si with
the crystalline Si dendrites on top. The drastic increase (similar to
4 orders of magnitude) of electrical conductivity of the 200 degrees C
annealed (n(+))a-Si:H films with the Al-1%Si removed is caused by the
formation of polycrystalline silicon percolation channel in the backg
round area between dendrites. Auger spectroscopy also provides evidenc
e that no aluminum is incorporated into the converted film during sili
con recrystallization and thus no SiAl alloy is formed. (C) 1997 Ameri
can Institute of Physics.