Thermal analysis: the next two decades

Citation
Szd. Cheng et al., Thermal analysis: the next two decades, THERMOC ACT, 355(1-2), 2000, pp. 59-68
Citations number
62
Categorie Soggetti
Spectroscopy /Instrumentation/Analytical Sciences
Journal title
THERMOCHIMICA ACTA
ISSN journal
00406031 → ACNP
Volume
355
Issue
1-2
Year of publication
2000
Pages
59 - 68
Database
ISI
SICI code
0040-6031(20000731)355:1-2<59:TATNTD>2.0.ZU;2-A
Abstract
As some of the most important analytical methods, thermal analysis techniqu es have been greatly improved and perfected due to the requirements of mate rials characterization. Over the past four decades, the major developments have been associated with computerizing thermal analysis techniques. In the coming 20 years, thermal analysis techniques will continue to develop in a t least two different directions. First, more precise measurements can be c arried out using traditional thermal analysis techniques by making a small extra effort. This will lead to a variety of new information regarding a ma terial's structure interface and morphology obtained from the results. Seco nd, thermal analysis techniques can be combined with other in-situ temperat ure-controlled experiments, such as diffraction, scattering, microscopy, an d spectroscopy, for investigation of the structure and dynamics of material s. This will generate information of the structural evolution with changing thermal properties and therefore, greatly aid in the understanding of stru cture-property relationships of the materials. (C) 2000 Elsevier Science B. V. All rights reserved.