Chemical fluid deposition: A hybrid technique for low-temperature metallization

Citation
Dp. Long et al., Chemical fluid deposition: A hybrid technique for low-temperature metallization, ADVAN MATER, 12(12), 2000, pp. 913-915
Citations number
12
Categorie Soggetti
Multidisciplinary,"Material Science & Engineering
Journal title
ADVANCED MATERIALS
ISSN journal
09359648 → ACNP
Volume
12
Issue
12
Year of publication
2000
Pages
913 - 915
Database
ISI
SICI code
0935-9648(20000616)12:12<913:CFDAHT>2.0.ZU;2-V
Abstract
Chemical fluid deposition (CFD) is a novel approach to metal deposition tha t involves the chemical reduction of organome- tallic compounds in supercri tical carbon dioxide to yield high purity films at low temperature. Since s upercritical CO2 can exhibit densities that approach those of a liquid solv ent while retaining the transport properties of a gas, CFD is essentially a hybrid technique that uniquely blends the advantages of chemical vapor dep osition (CVD) and electroless plating. Here, we describe the deposition of high-purity films of Pt, Pd, Au, and Rh onto inorganic and polymer substrat es by the reduction of appropriate precursors in CO2 at 60 degrees C.