On the possibility of diamond wafer bonding in ultrahigh vacuum

Citation
D. Conrad et al., On the possibility of diamond wafer bonding in ultrahigh vacuum, APPL PHYS L, 77(1), 2000, pp. 49-51
Citations number
16
Categorie Soggetti
Apllied Physucs/Condensed Matter/Materiales Science
Journal title
APPLIED PHYSICS LETTERS
ISSN journal
00036951 → ACNP
Volume
77
Issue
1
Year of publication
2000
Pages
49 - 51
Database
ISI
SICI code
0003-6951(20000703)77:1<49:OTPODW>2.0.ZU;2-4
Abstract
The possibility of bonding clean diamond surfaces covalently in ultrahigh v acuum is investigated by molecular dynamics simulations based on a tight bi nding model. Our simulations predict that strong covalent bonding is possib le for C(001)-2x1 surfaces. C(111)-2x1 surfaces will bond very weakly and d ebond already at moderate temperatures. (C) 2000 American Institute of Phys ics. [S0003-6951(00)03027-8].