Ta2O5 is a candidate for use in metal-oxide-metal (MOM) capacitors in sever
al areas of silicon device technology. Understanding and controlling leakag
e current is critical for successful implementation of this material. We ha
ve studied thermal and photoconductive charge transport processes in Ta2O5
MOM capacitors fabricated by anodization, reactive sputtering, and chemical
vapor deposition. We find that the results from each of these three method
s are similar if one compares films that have the same thickness and electr
odes. Two types of leakage current are identified: (a) a transient current
that charges the bulk states of the films and (b) a steady state activated
process involving electron transport via a defect band. The transient proce
ss involves either tunneling conductivity into states near the Fermi energy
or ion motion. The steady state process, seen most commonly in films < 300
Angstrom thick, is dominated by a large number of defects, similar to 10(1
9)-10(20) cm(-3), located near the metal-oxide interfaces. The interior of
thick Ta2O5 films has a substantially reduced number of defects. Modest hea
ting (300-400 degrees C) of Ta2O5 in contact with a reactive metal electrod
e such as Al, Ti, or Ta results in interfacial reactions and the diffusion
of defects across the thickness of the film. These experiments show that su
ccessful integration of Ta2O5 into semiconductor processing requires a bett
er understanding of the impact of defects on the electrical characteristics
and a better control of the metal-Ta2O5 interface. (C) 2000 American Insti
tute of Physics. [S0021-8979(00)03514-3].