Corrosion behavior and adhesion of ion-plated TiN films on AISI 304 steel

Citation
Jy. Chen et al., Corrosion behavior and adhesion of ion-plated TiN films on AISI 304 steel, MATER CH PH, 65(3), 2000, pp. 310-315
Citations number
9
Categorie Soggetti
Apllied Physucs/Condensed Matter/Materiales Science","Material Science & Engineering
Journal title
MATERIALS CHEMISTRY AND PHYSICS
ISSN journal
02540584 → ACNP
Volume
65
Issue
3
Year of publication
2000
Pages
310 - 315
Database
ISI
SICI code
0254-0584(20000815)65:3<310:CBAAOI>2.0.ZU;2-V
Abstract
Titanium nitride films were deposited on AISI 304 steel with a hollow-catho de-discharge (HCD) ion-plating technique. An extensive investigation on the corrosion behavior and adhesion of TiN-coated samples was performed. The c orrosion resistance was evaluated by a potentiodynamic polarization method in 1 N H2SO4+0.05 M KSCN solution and the ASTM standard B-117 salt spray te st. The ultimate shear stress, proportional to the banding strength between coating and substrate, was measured by a periodic cracking method to refle ct the adhesion of the coating. To obtain good adhesion of the TiN film to the substrate, a Ti interlayer was introduced to form a TiN/Ti/steel struct ure. The experimental results demonstrate that the corrosion properties of the TiN-coated AISI 303 steel samples are determined first by the influence of the synergetic effect, that is the packing factor and the thickness ass ociated with the coatings, and second by the adhesion of TiN coatings to th e substrate. From the results of the interfacial stress and SIMS depth-prof ile measurements, the adhesive strength of the coated-samples increases wit h increasing interdiffusion layer thickness. Furthermore, it also indicates that the Ti sublayer can enlarge the pseudo-diffusion layer and enhance th e adhesion strength of TiN coatings. For the TiN/Ti double-layered coating, good corrosion resistance can be obtained with the measured ultimate shear stress higher than 10 GPa and the interdiffusion zone thicker than 0.2 mu m (C) 2000 Elsevier Science S.A. All rights reserved.