lOxide layers have been grown on single crystal(100) Si and SiGe surfaces w
ith exposure to a pulsed UV laser at 266 nm under various controlled enviro
nments. During the growth, sample surfaces were first melted by the laser p
ower, Oxygen related species then diffused into the melt. Oxide was formed
after the samples re-solidified. Besides the strong stretching mode absorpt
ion at 1080 cm(-1) (T-2 mode), there was an intense shoulder around 1200 cm
(-1) (the A(1) mode) in the Fourier transform infrared spectrum, compared t
o thermal oxide. The relative intensity of the shoulder decreased with ambi
ent water vapor concentration. The porosity of this oxide leads to the inte
nse shoulder and more water vapor incorporation can decrease the porosity.
The porous oxide could be annealed to some extent with a high-temperature t
hermal process. Because the adsorption and diffusion of water molecules to
and in melted silicon are easier than oxygen molecules, ambient water vapor
can fill the voids in the oxide more efficiently and leads to less signifi
cant absorption shoulder than oxygen molecules. Also because the diffusion
of water molecules in Ge is faster than in Si, less voids are formed and he
nce the absorption shoulder is less prominent in SiGe samples. (C) 2000 Els
evier Science S.A. All rights reserved.