Effect of thermal annealing on Co/n-LEC GaAs (Te) Schottky contacts

Citation
C. Nuhoglu et al., Effect of thermal annealing on Co/n-LEC GaAs (Te) Schottky contacts, SOL ST COMM, 115(6), 2000, pp. 291-295
Citations number
27
Categorie Soggetti
Apllied Physucs/Condensed Matter/Materiales Science
Journal title
SOLID STATE COMMUNICATIONS
ISSN journal
00381098 → ACNP
Volume
115
Issue
6
Year of publication
2000
Pages
291 - 295
Database
ISI
SICI code
0038-1098(2000)115:6<291:EOTAOC>2.0.ZU;2-J
Abstract
The Co/n-GaAs(Te) Schottky barrier diodes have been annealed at temperature s from 100 to 300 degrees C for 5 min and from 350 to 800 degrees C for 1 m in in N-2 atmosphere. Some expressions have been obtained to interpret the relation between the experiment barrier height Phi(b,o) and equilibrium int erface charge density Q(ss)(0) depending on annealing temperature. The Phi( b,o) value has increased and Q(ss)(0) is decreased with increasing annealin g temperature up to 550 degrees C. This increase in the barrier height has been attributed to the value of positive Q(ss)(0), which is responsible for the Fermi level pinning. The relation between the Phi(b,o), and Q(ss)(0) d epending on annealing temperature is in very good agreement with that of th e interface state density distribution especially in the mid-gap. (C) 2000 Elsevier Science Ltd. All rights reserved.