REACTIVE ION ETCHING (RIE) AS A METHOD FOR TEXTURING POLYCRYSTALLINE SILICON SOLAR-CELLS

Citation
S. Winderbaum et al., REACTIVE ION ETCHING (RIE) AS A METHOD FOR TEXTURING POLYCRYSTALLINE SILICON SOLAR-CELLS, Solar energy materials and solar cells, 46(3), 1997, pp. 239-248
Citations number
14
Categorie Soggetti
Energy & Fuels","Material Science
ISSN journal
09270248
Volume
46
Issue
3
Year of publication
1997
Pages
239 - 248
Database
ISI
SICI code
0927-0248(1997)46:3<239:RIE(AA>2.0.ZU;2-L
Abstract
Reactive ion etching (RIE) has been applied and developed as a method for texturing polycrystalline silicon solar cells. Two structures (mic rogrooves and pyramids) were produced in this work. Reflectivity measu rements between 400-1200 nm show an overall reflectance of 5.6% for py ramid and 7.9% for groove structures. These results are better than th ose using wet anisotropic etch techniques on single-crystal silicon. R IE texturing was performed on cast polycrystalline silicon and produce d better reflection control than standard TiO2 antireflection coatings . RIE texturing also changes the incidence angle of light into the sil icon, this improves the response for long wavelengths which can be uti lised in thin film, polycrystalline or amorphous silicon solar cells.