S. Winderbaum et al., REACTIVE ION ETCHING (RIE) AS A METHOD FOR TEXTURING POLYCRYSTALLINE SILICON SOLAR-CELLS, Solar energy materials and solar cells, 46(3), 1997, pp. 239-248
Reactive ion etching (RIE) has been applied and developed as a method
for texturing polycrystalline silicon solar cells. Two structures (mic
rogrooves and pyramids) were produced in this work. Reflectivity measu
rements between 400-1200 nm show an overall reflectance of 5.6% for py
ramid and 7.9% for groove structures. These results are better than th
ose using wet anisotropic etch techniques on single-crystal silicon. R
IE texturing was performed on cast polycrystalline silicon and produce
d better reflection control than standard TiO2 antireflection coatings
. RIE texturing also changes the incidence angle of light into the sil
icon, this improves the response for long wavelengths which can be uti
lised in thin film, polycrystalline or amorphous silicon solar cells.