Free-space parallel multichip interconnection system

A parallel data-communication scheme is described for interchip communicati on with free-space optics. me present a proof-of-concept and feasibility de monstration of a practical modular packaging approach in which free-space o ptical interconnect modules can be simply integrated on top of an electroni c multichip module (MCM). Our packaging architecture is based on a modified folded 4-f imaging system that is implemented with off-the-shelf optics, c onventional electronic packaging techniques, and passive assembly technique s to yield a potentially low-cost packaging solution. The prototype system, as built, supports 48 independent free-space channels with eight separate laser and detector chips, in which each chip consists of a one-dimensional array of 12 devices. All chips are assembled on a single ceramic carrier to gether with three silicon complementary metal-oxide semiconductor chips. Pa rallel optoelectronic (OE) free-space interconnections are demonstrated at a speed of 200 MHz. The system is compact at only 10 in.(3) (similar to 164 cm(3)) and is scalable because it can easily accommodate additional chips as well as two-dimensional OE device arrays for increased interconnection d ensity. (C) 2000 Optical Society of America. OCIS codes: 200.4650, 200.2610 , 200.0200, 250.0250.