A new generation of thermal uncooled focal plane array has been develo
ped in the context of PROMETHEUS PROCHIP European Program (EUREKA) as
a passive infrared obstacle detection applied to automotive [1]. The i
nfrared detection uses the pyroelectric effect in VDF/TrFE copolymer.
VDF/TrFE pyroelectric sensors have now definitely reached the level of
a product. Based on a bidimensional matrix array, it can be considere
d as a whole system with a monolithic technology processed on an indus
trial silicon substrate provided with the integrated CMOS readout circ
uit. The paper will describe the main procedures dealing with the fabr
ication of a 32 x 32 - 100 mu m pitch - Focal Plane Array (FPA) develo
ped for very low cost infrared applications. The design architecture,
a complete model of detection and the sensor performances are presente
d.