Electrochemical deposition of copper in polyaniline films - number densityand spatial distribution of deposited metal clusters

Citation
V. Tsakova et D. Borissov, Electrochemical deposition of copper in polyaniline films - number densityand spatial distribution of deposited metal clusters, ELECTROCH C, 2(7), 2000, pp. 511-515
Citations number
11
Categorie Soggetti
Physical Chemistry/Chemical Physics
Journal title
ELECTROCHEMISTRY COMMUNICATIONS
ISSN journal
13882481 → ACNP
Volume
2
Issue
7
Year of publication
2000
Pages
511 - 515
Database
ISI
SICI code
1388-2481(200007)2:7<511:EDOCIP>2.0.ZU;2-Q
Abstract
The electrochemical deposition of copper in reduced polyaniline (PAN) films is studied at different polymer layer thicknesses. A saturation in the num ber density, n(0), of active sites for metal deposition is found at 0.5 mu m PAN thickness (n(0)=10(8) cm(-2)). The surface spatial distribution of th e deposited copper crystals is analysed in two cases. It is found that nucl eation exclusion zones play are appreciable role in the course of the depos ition process in thin PAN films. In contrast, a random distribution and a l arger number of deposited crystals are obtained in thicker PAN layers. (C) 2000 Elsevier Science S.A. All rights reserved.