Electrochemical deposition of copper in polyaniline films - number densityand spatial distribution of deposited metal clusters

The electrochemical deposition of copper in reduced polyaniline (PAN) films is studied at different polymer layer thicknesses. A saturation in the num ber density, n(0), of active sites for metal deposition is found at 0.5 mu m PAN thickness (n(0)=10(8) cm(-2)). The surface spatial distribution of th e deposited copper crystals is analysed in two cases. It is found that nucl eation exclusion zones play are appreciable role in the course of the depos ition process in thin PAN films. In contrast, a random distribution and a l arger number of deposited crystals are obtained in thicker PAN layers. (C) 2000 Elsevier Science S.A. All rights reserved.