Use of transient enhanced diffusion to tailor boron out-diffusion

Citation
Hh. Vuong et al., Use of transient enhanced diffusion to tailor boron out-diffusion, IEEE DEVICE, 47(7), 2000, pp. 1401-1405
Citations number
12
Categorie Soggetti
Eletrical & Eletronics Engineeing
Journal title
IEEE TRANSACTIONS ON ELECTRON DEVICES
ISSN journal
00189383 → ACNP
Volume
47
Issue
7
Year of publication
2000
Pages
1401 - 1405
Database
ISI
SICI code
0018-9383(200007)47:7<1401:UOTEDT>2.0.ZU;2-A
Abstract
We report experimental results demonstrating the use of transient enhanced diffusion (TED) caused by silicon implant for "tuning" boron out-diffusion. The effect was measured as a function of the silicon implant dose and anne al temperature, and a range of boron junction depth movement from almost no ne up to 81 nm was observed with increasing TED at 750 degrees C. The diffu sed profiles could be approximated by using a modified solubility limit mod el to describe the enhanced boron diffusion and clustering. However, by usi ng a more sophisticated continuum model based on atomistic calculations, ex cellent agreement with the measured profiles could be obtained. In addition , the fit to the measured data yields the fraction of boron present in BI2 precursor clusters after silicon implant as a function of the silicon impla nt dose. Two possible applications of the TED "tuning" are discussed, with device simulations which show that the effect is sufficiently large to tune the base width of a bipolar device from being depleted to that suitable fo r a high performance device.