A novel thermal actuator for the determination of polysilicon fracture stre
ngth and investigation of its fatigue is presented. The actuator consists o
f two narrow beams, which expand due to electrical heating, and a cold plat
e to which a short fracture beam is attached. Because of its small dimensio
ns, the actuator can be used for on-wafer testing, This method is suitable
for tensile and compressive material. Using different types of fracture bea
ms fracture strengths were compared for uniaxial tension and bending test.
Using Weibull statistics, the fracture strength for polysilicon has been fo
und to be (2.9 +/- 0.5) GPa in tensile tests and (3.4 +/- 0.5) GPa in bendi
ng tests. In fatigue investigations, we observe that fracture strength decr
eases slowly with time to 2.2 GPa after 10(6) cycles.