Fracture strength and fatigue of polysilicon determined by a novel thermalactuator

Citation
H. Kapels et al., Fracture strength and fatigue of polysilicon determined by a novel thermalactuator, IEEE DEVICE, 47(7), 2000, pp. 1522-1528
Citations number
19
Categorie Soggetti
Eletrical & Eletronics Engineeing
Journal title
IEEE TRANSACTIONS ON ELECTRON DEVICES
ISSN journal
00189383 → ACNP
Volume
47
Issue
7
Year of publication
2000
Pages
1522 - 1528
Database
ISI
SICI code
0018-9383(200007)47:7<1522:FSAFOP>2.0.ZU;2-M
Abstract
A novel thermal actuator for the determination of polysilicon fracture stre ngth and investigation of its fatigue is presented. The actuator consists o f two narrow beams, which expand due to electrical heating, and a cold plat e to which a short fracture beam is attached. Because of its small dimensio ns, the actuator can be used for on-wafer testing, This method is suitable for tensile and compressive material. Using different types of fracture bea ms fracture strengths were compared for uniaxial tension and bending test. Using Weibull statistics, the fracture strength for polysilicon has been fo und to be (2.9 +/- 0.5) GPa in tensile tests and (3.4 +/- 0.5) GPa in bendi ng tests. In fatigue investigations, we observe that fracture strength decr eases slowly with time to 2.2 GPa after 10(6) cycles.