Numerical simulation of compression molding of UHMWPE - part II. Residual stress model

In part I of this paper a thermal model was used for temperature prediction s within a compression molded disc. A process simulated laminate technique was used to measure residual stresses. The fast cooling cycle produced high residual stresses (similar to 10 MPa). The slow cooling cycle produced low residual stresses (similar to 1 MPa). The cycle with soak at crystallizati on also produced low residual stresses (similar to 2.6 MPa). The modeled an d measured values were in close agreement. A major portion of the residual stresses (similar to 70%) was developed within a short time period (similar to 10 min) after the end of crystallization for all the cycles.