Preparation of metallic electric circuit by selective electroplating on polypyrrole patterns

By selectively electroplating on conducting polypyrrole (PPY) patterns whic h were prepared using the photochemical oxidizing ability changes of an oxi dation polymerization agent such as iron(III) chloride, we found that metal fine patterns would be deposited on the face of substrates. By the use of this method, we will construct a novel manufacturing process of a metallic electric circuit board without using a metal foil bonding board as well as eliminating the steps of etching and removing resist. The copper electropla ting on the PPY pattern was achieved by the use of normal copper electropla ting bath. However, in contrast to on metals, the propagation of the electr odeposit along the surface of the PPY was observed during the electroplatin g process on the PPY pattern. The copper deposit forms first near the elect rical contact. then gradually propagates laterally along the surface of the PPY pattern. We also discussed the mechanism for this propagation of the e lectrodeposit.