Nitrogen plasma immersion ion implantation (PIII) into pure aluminium was p
erformed at voltages of -10 to -30 kV. Different temperatures, from 250 to
500 degrees C and incident fluences of 1.2-3.6 X 10(18) nitrogen atoms/cm(2
) were used to investigate the diffusion behaviour and AIN phase formation.
X-Ray diffraction (XRD) shows the formation of cubic AIN at temperatures b
elow 300 degrees C, whereas hexagonal AIN appears beyond 390 degrees C. No
observable diffusion was measured, using ion beam techniques, at temperatur
es below 300 degrees C, limiting the retained dose to approximately 10% of
the incident ion flux. At higher temperatures, thermally activated diffusio
n with an activation energy of approximately 1 eV leads to an inward diffus
ion, albeit not the formation of thick stoichiometric ALN layers. The retai
ned dose is increased to approximately 35% for 500 degrees C and a fluence
of 1.2 X 10(18) nitrogen atoms/cm(2). A long diffusion tail of nitrogen, be
low the solubility limit is detectable with SIMS, correlated with a lattice
expansion of the native Al by approximately 0.7%. (C) 2000 Elsevier Scienc
e S.A. All rights reserved.