Mr. Gungor et al., Molecular-dynamics study of the mechanism and kinetics of void growth in ductile metallic thin films, APPL PHYS L, 77(3), 2000, pp. 343-345
A molecular-dynamics study is presented of the mechanism and kinetics of vo
id growth and morphological evolution in ductile metallic thin films subjec
t to biaxial tensile strains. The void becomes faceted, grows, and relieves
strain by emission from its surface of pairs of screw dislocations with op
posite Burgers vectors. Repeated dislocation generation and propagation lea
ds to formation of a step pattern on the film's surfaces. A simple phenomen
ological kinetic model of void growth is derived. Such kinetic equations ca
n be used to formulate constitutive theories of plastic deformation for con
tinuum-scale modeling of void evolution. (C) 2000 American Institute of Phy
sics. [S0003-6951(00)00729-4].