Thermal stress analysis for polyimide thin film: The effect of solvent evaporation

We propose a stress model to account for the thermal stress caused by a mis match of isobaric expansivity, solvent evaporation, and imidization. The ev aporation strain term is given as functions of a viscosity,and solvent weig ht fraction. The proposed model is in very good agreement wit experimental data and gives useful information about the analysis of the thermal stress caused in polymeric films.