Oxygen precipitation in Czochralski grown silicon heat treated at 550 degrees C

Citation
J. Cheung et al., Oxygen precipitation in Czochralski grown silicon heat treated at 550 degrees C, SEMIC SCI T, 15(7), 2000, pp. 782-788
Citations number
31
Categorie Soggetti
Apllied Physucs/Condensed Matter/Materiales Science
Journal title
SEMICONDUCTOR SCIENCE AND TECHNOLOGY
ISSN journal
02681242 → ACNP
Volume
15
Issue
7
Year of publication
2000
Pages
782 - 788
Database
ISI
SICI code
0268-1242(200007)15:7<782:OPICGS>2.0.ZU;2-J
Abstract
The diffusion of oxygen in silicon at 550 degrees C is studied using small- angle neutron scattering (SANS) and the diffusion coefficient, D, calculate d from Ham's theory is found to be similar to 10 times higher than that exp ected by extrapolation of higher- and lower-temperature data (D = 0.13 exp( -2.53 eV kT(-1)) cm(2) s(-1)). This result confirms previous observations o f enhanced diffusion at intermediate temperatures (400-650 degrees C) altho ugh the magnitude of the enhancement we find is much smaller than that repo rted by some others. At 550 degrees C the precipitates observed initially b y SANS appear to be spherical. For longer annealing times, the scattering b ecomes anisotropic, suggesting that a cuboidal morphology is developing.