Effect of heating time below the melting temperature on polyphenylene sulfide adhesive joint development

Authors
Citation
Z. Mei et Ddl. Chung, Effect of heating time below the melting temperature on polyphenylene sulfide adhesive joint development, INT J ADHES, 20(4), 2000, pp. 273-277
Citations number
10
Categorie Soggetti
Material Science & Engineering
Journal title
INTERNATIONAL JOURNAL OF ADHESION AND ADHESIVES
ISSN journal
01437496 → ACNP
Volume
20
Issue
4
Year of publication
2000
Pages
273 - 277
Database
ISI
SICI code
0143-7496(200008)20:4<273:EOHTBT>2.0.ZU;2-B
Abstract
A long heating time below the melting temperature (T-m) was found to be det rimental to subsequent polyphenylene sulfide (PPS) adhesive joint developme nt above T-m. This was found to be due to curing reactions below T-m and co nsequent reduced mass flow response above T-m. A high heating rate (small h eating time) enhanced the bonding more than a high pressure. The study was conducted by measurement of the contact electrical resistance of the joint, and was supported by calorimetry. (C) 2000 Elsevier Science Ltd. All right s reserved.