Z. Mei et Ddl. Chung, Effect of heating time below the melting temperature on polyphenylene sulfide adhesive joint development, INT J ADHES, 20(4), 2000, pp. 273-277
A long heating time below the melting temperature (T-m) was found to be det
rimental to subsequent polyphenylene sulfide (PPS) adhesive joint developme
nt above T-m. This was found to be due to curing reactions below T-m and co
nsequent reduced mass flow response above T-m. A high heating rate (small h
eating time) enhanced the bonding more than a high pressure. The study was
conducted by measurement of the contact electrical resistance of the joint,
and was supported by calorimetry. (C) 2000 Elsevier Science Ltd. All right
s reserved.