V. Aubry-fortuna et al., Phase formation and strain relaxation during thermal reaction of Zr and Tiwith strained Si1-x-yGexCy epilayers, J APPL PHYS, 88(3), 2000, pp. 1418-1423
Silicides are often used in Si technology for both their ohmic and rectifyi
ng properties. In this work, we have compared Zr and Ti germanosilicides as
possible metallic contacts on SiGeC alloys in terms of phase formation and
stability of the unreacted SiGeC alloy. The germanosilicides are obtained
after rapid thermal annealings of Zr or Ti with strained SiGeC layers. The
interactions of the metal films with these alloys have been investigated by
sheet resistance measurements, x-ray diffraction (XRD), cross-sectional tr
ansmission electron microscopy (TEM), and energy dispersive spectroscopy in
situ in the TEM. Four crystal x-ray diffraction was performed to measure t
he residual strain of the unreacted SiGeC epilayer after reaction. The anal
yses indicate that the final compounds are the C49-Zr(SiGe)(2) and C54-Ti(S
iGe)(2) phases, respectively: In both cases, the compound is formed by mono
crystalline grains with various orientations. Nevertheless, neither XRD, no
r sheet resistance measurements give any clear information about the C inco
rporation in the phase, when the reaction occurs with a SiGeC layer. We hav
e observed that the use of Zr completely avoids Ge segregation with an unif
orm layer formed, while in the case of the reaction with Ti, the grains do
not form a continuous layer and Ge-segregation is evidenced: A Ge-rich Si1-
z-yGez(C-y) alloy is detected in between the metallic grains. In addition,
an early strain relaxation of the unreacted SiGe layer is observed after re
action, and it is much more important after reaction with Ti. During the re
action with nearly compensated SiGeC layers, Zr totally prevents the initia
l state of strain, while Ti strongly affects the unreacted SiGeC alloy and
destroys its initial state. All these results indicate that Zr may be an in
teresting candidate for realizing germanosilicide contacts on IV-IV alloys,
due to its good thermal stability. (C) 2000 American Institute of Physics.
[S0021-8979(00)08715-6].