Chemical vapor deposition of silicon-germanium heterostructures

Citation
S. Bozzo et al., Chemical vapor deposition of silicon-germanium heterostructures, J CRYST GR, 216(1-4), 2000, pp. 171-184
Citations number
49
Categorie Soggetti
Physical Chemistry/Chemical Physics
Journal title
JOURNAL OF CRYSTAL GROWTH
ISSN journal
00220248 → ACNP
Volume
216
Issue
1-4
Year of publication
2000
Pages
171 - 184
Database
ISI
SICI code
0022-0248(200007)216:1-4<171:CVDOSH>2.0.ZU;2-3
Abstract
We report on the growth of SiGe/Si heterostructures in a commercial chemica l vapor deposition cold-wall vertical reactor using SiH4 and GeH4 gas precu rsors, and we discuss their structural quality. The machine is versatile as it operates in a wide range of temperature and pressure, allowing both the ultra high vacuum and a low-pressure-like regime. In the two growth modes, the Si and SiGe deposition rates and the Ge fraction are calibrated as a f unction of the temperature and the hydrides partial pressures. The LP-CVD r egime is appropriate for the realization of thick gradually relaxed Si0.75G e0.25/Si pseudo-substrates. The role of the grading rate (5-20% Ge/mu m) on the density of threading dislocations and the surface roughness is discuss ed. Seven-period Si0.70Ge0.30/Si superlattices were grown by UHV-CVD to stu dy the interfacial chemical abruptness and morphological roughness by means of X-ray diffraction, rutherford backscattering and transmission electron microscopy techniques. Results are strongly dependent on the growth tempera ture in the 575-625 degrees C range. (C) 2000 Elsevier Science B.V. All rig hts reserved.