The nanostructure around the wetting triple line in the Ag-Cu-Ti/SiC reacti
ve wetting system was studied. The reaction product consisted of an upper s
eparated Ti5Si3 layer more than 20 nm thick, and a lower TiC layer less tha
n 10 nm thick was observed exceeding the front line of Ag-Cu-Ti brazing met
al. At the top of the reaction product, the lower TiC layer was observed to
project beyond the front line of the upper Ti5Si3 layer. In Ag-Cu-Ti/Si3N4
system, structural change around the wetting triple line as reactive wetti
ng progressed has been reported, however, in the Ag-Cu-Ti/SiC system, the s
tructure around the triple line did not change. The difference between the
two systems was explained from the viewpoint of a stable phase change with
the decrease of Ti activity as reactive wetting progressed. (C) 2000 Kluwer
Academic Publishers.