Effects of a new combination of additives in electroplating solution on the properties of Cu films in ULSI applications

Authors
Hu, JC Chang, TC Wu, CW Chen, LJ Hsiung, CS Hsieh, WY Lur, W Yew, TR
Citation
Jc. Hu et al., Effects of a new combination of additives in electroplating solution on the properties of Cu films in ULSI applications, J VAC SCI A, 18(4), 2000, pp. 1207-1210
Citations number
11
Categorie Soggetti
Apllied Physucs/Condensed Matter/Materiales Science","Material Science & Engineering
Journal title
JOURNAL OF VACUUM SCIENCE & TECHNOLOGY A-VACUUM SURFACES AND FILMS
ISSN journal
07342101 → ACNP
Volume
18
Issue
4
Year of publication
2000
Part
1
Pages
1207 - 1210
Database
ISI
SICI code
0734-2101(200007/08)18:4<1207:EOANCO>2.0.ZU;2-O
Abstract
Effects of a new combination of additives in acid electroplating solution o n the properties of Cu thin films have been investigated, The electroplated Cu films exhibit an excellent superfilling behavior. 0.18 mu m vias with a n aspect ratio exceeding 5 were filled completely without any void or seam. Strong (111) texture was found for the electroplated Cu films. The resisti vity of a 450-nm-thick Cu film was measured to be 1.84 mu Omega cm. (C) 200 0 American Vacuum Society. [S0734-2101(00)08004-0].