Signal integrity analysis of interconnects using the FDTD method and a layer peeling technique

This paper presents the application of an impedance layer peeling technique to network parameter extraction from finite-difference time-domain (FDTD) simulations. It is shown that the combination of both methods offers a simp le and efficient may to analyze lossless linear 1- or 2-port structures. Th e extraction of equivalent circuit models can be done entirely in the time domain and the optimization of lumped element parameters is not necessary. Special attention is paid to the problem of injecting voltage steps with sh ort risetimes into the FDTD grid. Results obtained with this technique are compared to network analyzer measurements and usual FDTD annlysis based on scattering parameter extraction.