Impact of technology scaling in SOI back-channel total dose tolerance. A 2-C numerical study using self-consistent oxide code

Citation
Jl. Leray et al., Impact of technology scaling in SOI back-channel total dose tolerance. A 2-C numerical study using self-consistent oxide code, IEEE NUCL S, 47(3), 2000, pp. 620-626
Citations number
9
Categorie Soggetti
Apllied Physucs/Condensed Matter/Materiales Science","Nuclear Emgineering
Journal title
IEEE TRANSACTIONS ON NUCLEAR SCIENCE
ISSN journal
00189499 → ACNP
Volume
47
Issue
3
Year of publication
2000
Part
1
Pages
620 - 626
Database
ISI
SICI code
0018-9499(200006)47:3<620:IOTSIS>2.0.ZU;2-L
Abstract
A new 2D-self-consistent code has been developed and is applied to the unde rstanding of charge trapping in SOI buried oxides and its effect on back-ch annel MOS leakage in SOI transistors. 2D effects, field-collapse and field- enhancement are observed. Clear indications on scaling trends are obtained with respect to supply voltage and oxide thickness. In thinner oxides, 2D e ffects are observed for example, the onset of back-channel leakage current is found to be related to the ratio of the channel length on the oxide thic kness.