M. Vergohl et al., Stabilization of high-deposition-rate reactive magnetron sputtering of oxides by in situ spectroscopic ellipsometry and plasma diagnostics, J VAC SCI A, 18(4), 2000, pp. 1709-1712
A control system for stabilizing the reactive magnetron-sputter process is
applied that is based on a combination of a short-term stabilization of the
plasma and a long-term stabilization employing an in situ spectroscopic el
lipsometer. For the formation of niobium pentoxide, a measurement of the re
active gas partial pressure with a lambda-probe measurement was employed. I
t turns out that the specific deposition rate, i.e,, deposition rate divide
d by the power density, is a suitable control parameter. Compared to the ox
ide model the deposition rate of niobium pentoxide films deposited in the t
ransition mode could be enlarged by a factor of more than 4. The films were
grown at different process parameters (oxygen partial pressure, target pow
er, absolute pressure, midfrequency and de technique) onto unheated substra
tes. In situ! spectroscopic ellipsometry and ex situ spectroscopic ellipsom
etry at different angles of incidence and scanning electron microscopy inve
stigations were applied to study the optical properties and the morphology
of the films. (C) 2000 American Vacuum Society. [S0734-2101(00)07604-1].