We have deposited thick SiC thin films on graphite substrates in the temper
ature range of 700-850 degrees C using single-molecular precursors by both
thermal metal-organic chemical-vapor deposition (MOCVD) and plasma-enhanced
MOCVD (PEMOCVD) methods for oxidation-protection wear and tribological coa
ting. Hexamethyldisilane (HMDS), (CH3)(3)Si-Si(CH3)(3), was used as a singl
e-source precursor, and hydrogen and Ar were used as a bubbler and carrier
gas. A highly oriented polyerystalline cubic SiC layer in the [111] directi
on was successfully deposited on graphite at temperatures as low as 800 deg
rees C with HMDS by PEMOCVD. For thermal MOCVD, on the other hand, only amo
rphous SiC layers were obtained at 850 degrees C. From this study, we confi
rmed that PEMOCVD was a highly effective process in improving the character
istics of the SiC layers compared to those grown by thermal MOCVD. The mech
anical and oxidation-resistant properties have been assessed. The optimum S
iC film was obtained at 850 degrees C and rf power of 200 W. The maximum de
position rate and microhardness are 2 mu m/h and 4336 kg/mm(2) Hv, respecti
vely. The hardness was strongly influenced by the composition ratio of the
SiC protective layers. (C) 2000 American Vacuum Society. [S0734-2101(00)182
04-1].