Magnetic tunnel junctions may experience failure due to local shortcuts in
the insulating layers of such devices. To further develop magnetic tunnel j
unctions. the areal density of pinholes must be analyzed. By electrodeposit
ing copper, we have developed a method to image pinholes and analyze the de
nsity of pinholes. Copper selectively nucleates at particular sites, formin
g structures that can be visualized using an optical microscope. Using this
method, we examined the change in size of grown copper structures over tim
e and the increase in the areal density of defects as a function of the app
lied electrodeposition potential. (C) 2000 American Vacuum Society. [S0734-
2101(00)05704-3].