Tantalum carbide (TaC) has great potential as an alternative to tantalum an
d tantalum oxide for applications requiring thermal stability and corrosion
resistance. In this study TaC layers were produced by inductive rf plasma-
assisted chemical vapor deposition that combines diffusion with chemical va
por deposition. The maximum temperature of the tantalum substrates measured
during a 6 h processing time was 900 degrees C using Ar-CH4 or Ar-CH4-H-2
gas mixtures. The microstructure of the layers was characterized by X-ray d
iffraction and Auger electron spectroscopy, and the mechanical properties w
ere studied by micro- and nanoindentation and by microscratch techniques. A
close correlation among the carburizing parameters, the microstructure, th
e mechanical behavior of the layers, and the corrosion resistance was found
. The best performing films, several mu m thick, consisting of TaC phase wi
th the highest hardness (similar to 25 GPa), were obtained under the follow
ing conditions: input power of 1400 W, pressure of 40-60 mbar, and substrat
e located at the center of the rf coil. The effect of gas composition, gas
pressure, and substrate temperature on the layer composition, the TaC/Ta2C
phase ratio, and the mechanical characteristics and chemical stability is p
resented and discussed. A mechanism of carburizing of tantalum in an induct
ive rf plasma is proposed. (C) 2000 American Vacuum Society. [S0734-2101(00
)10504-4].