Electroplated electro-fluidic interconnects for chemical sensors

A wet chip electro-fluidic packaging technology based on electroplating is described. An electroplated gold seal provides the sensor's fluid connectio n to a silicon multi-chip module. A hermetic seal is obtained using the gol d-silicon eutectic bond. The sensor's electrical connections to the multi-c hip module are made by eutectic bonding electroplated gold-tin solder bumps on the sensor to gold pads on the substrate. The fluid and electrical conn ections are made simultaneously, and the process is compatible with the fli p-chip bonding technique. (C) 2000 Elsevier Science S.A. All rights reserve d.