STUDY OF FAILURE MODES OF MICROELECTRONIC PACKAGING MODULES BY HOLOGRAPHY QUASI PROJECTION MOIRE METHOD

Authors
SHI XQ LIU BC DAI FL
Citation
Xq. Shi et al., STUDY OF FAILURE MODES OF MICROELECTRONIC PACKAGING MODULES BY HOLOGRAPHY QUASI PROJECTION MOIRE METHOD, Acta Mechanica Sinica, 13(2), 1997, pp. 179-185
Citations number
6
Categorie Soggetti
Engineering, Mechanical",Mechanics
Journal title
Acta Mechanica Sinica → ACNP
ISSN journal
05677718
Volume
13
Issue
2
Year of publication
1997
Pages
179 - 185
Database
ISI
SICI code
0567-7718(1997)13:2<179:SOFMOM>2.0.ZU;2-N
Abstract
In this paper, a novel interferometric method with a wide range of sen sitivities, called holography quasi projection moire, is proposed. It combines the features of the variated double projection moire method a nd the holographic interferometry method. This technique is used to st udy the failure modes of microelectronic packaging modules.