STUDY OF THERMAL DEFORMATION OF MICROELECTRONICS PACKAGING PRODUCT BYINTERFEROMETRIC-TECHNIQUE

In this paper, the out-of-plane deformation of silicon surface of Dire ct Chip Attachment (DCA) assembly, under thermal loading, was measured in real-time by Twyman/Green interferometry. The contour maps of the out-of-plane displacement fields of silicon surface under thermal load ing and cycling of various temperature were obtained, Experimental res ults show that the relation between the out-of-plane displacement and temperature is nonlinear and varies with temperature cycling, due to n onlinear mechanical behavior of the materials used in electronic packa ging. A comparison of the aut-of-plane displacement Gelds of silicon s urface measured by T/G interferometry in real-time and replicating tec hnique of high temperature specimen grating of moire interferometry wa s made.