Computational electromagnetic methods for interconnects and small structures

The continual advances in speed and integration scale of electronic circuit s have created enormous demands for high-speed, high-density packages which ensure reduced interconnection delays and improved electrical performance. Such structures usually involve a large number of planar transmission line s at various levels within the package, whereas the geometrical orientation of these lines is not necessarily uniform. Also, the existence of multiple dielectric layers, discontinuities, bends, and wire bounds adds considerab le complexity to the package. It is therefore essential that full-wave comp utational electromagnetic (CEM) techniques, such as the finite element meth od (FEM) and the finite-difference time-domain (FDTD) method, be developed and used to accurately model the electrical performance of these devices an d circuits. (C) 2000 Academic Press.