Dendrimers with thermally labile end groups: An alternative approach to chemically amplified resist materials designed for sub-100 nm lithography

Citation
Dc. Tully et al., Dendrimers with thermally labile end groups: An alternative approach to chemically amplified resist materials designed for sub-100 nm lithography, ADVAN MATER, 12(15), 2000, pp. 1118
Citations number
33
Categorie Soggetti
Multidisciplinary,"Material Science & Engineering
Journal title
ADVANCED MATERIALS
ISSN journal
09359648 → ACNP
Volume
12
Issue
15
Year of publication
2000
Database
ISI
SICI code
0935-9648(20000802)12:15<1118:DWTLEG>2.0.ZU;2-4
Abstract
Chemically amplified resists based on dendritic polymer resins are investig ated by these authors. The synthesis of the dendrimers, which are based on the polyfunctional core shown in the Figure, is described and properties su ch as T-decomp and T-g are examined. Resist formulations prepared from thes e dendrimers are shown to be highly sensitive to both deep UV and e-beam ex posure, allowing reproducible patterning well below 100 nm.