Dendrimers with thermally labile end groups: An alternative approach to chemically amplified resist materials designed for sub-100 nm lithography

Chemically amplified resists based on dendritic polymer resins are investig ated by these authors. The synthesis of the dendrimers, which are based on the polyfunctional core shown in the Figure, is described and properties su ch as T-decomp and T-g are examined. Resist formulations prepared from thes e dendrimers are shown to be highly sensitive to both deep UV and e-beam ex posure, allowing reproducible patterning well below 100 nm.