Effects of copper content and heat treatment on the electrical properties of Ge15Te85-xCux thin films

Citation
M. Dongol et al., Effects of copper content and heat treatment on the electrical properties of Ge15Te85-xCux thin films, APPL SURF S, 161(3-4), 2000, pp. 365-374
Citations number
17
Categorie Soggetti
Apllied Physucs/Condensed Matter/Materiales Science","Material Science & Engineering
Journal title
APPLIED SURFACE SCIENCE
ISSN journal
01694332 → ACNP
Volume
161
Issue
3-4
Year of publication
2000
Pages
365 - 374
Database
ISI
SICI code
0169-4332(200007)161:3-4<365:EOCCAH>2.0.ZU;2-I
Abstract
The mechanism of incorporation of copper in amorphous films of Ge15Te85-x C u-x (0 less than or equal to x less than or equal to 7 at.%) system and the effect of heat treatment are studied by measuring the de conductivity in t he temperature range (150-423 K). The results indicates that there are two conduction mechanisms. For temperature above 330 K, conductivity exhibits a ctivated behaviour, while in low temperature range (T = 150-300 K) conducti vity exhibits non-activated behaviour. In the high temperature region, resi stance and the activation energy have been calculated. The decrease in the activation energy on addition of Cu has been interpreted according to the K astner model. In the low temperature region Mott's parameters have been eva luated and they are decreased with Cu content; the results in this region a re interpreted following Mott's model. (C) 2000 Published by Elsevier Scien ce B.V.